

| Single Plate Lapping & Polishing |
Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone |
Sealing | valve and sealing ring(liquid, oil, gas) |
| Semiconductor | LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) |
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| Plastic | PE, E/VAC, SBS, SBR, NBR, SR, BR, PR | ||
| Phone Frame(flat) | back plate | ||
| PCB | adhesive, coating, circuit | ||
| Optics(flat) | optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass | ||
| Radar | oxide coating plate | ||
| Gemstone | jade, sapphire, agate, etc. | ||
| Others | graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. | ||
| *NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed. | |||
| Model | 910LX-3Q |
| Grinding disc specifications | Φ910x 200 x 12t |
| Maximum workpiece size | Φ330mm |
| Ceramic dressing wheel specifications | Φ450mm x 410mm, 3pcs |
| Grinding disc speed | 90rpm |
| Timing range | 99 minutes and 59 seconds |
| Main motor power | 7.5kw.380V3 |
| Dressing motor power | 0.2kw.380V3 |
| Dressing speed | 0---120mm/min |
| External dimensions | 1600x2100 x 2200mm |
| Weight | 2550kg |